Zaram Technology 獲 2.97 billion 韓元 ASIC 供貨合約

Zaram Technology's ZX300 XGS-PON system-on-chip. (Photo: Zaram Technology)

Zaram Technology disclosed on Oct. 29 that it signed a 2.9713 billion won contract to supply application-specific integrated circuits (ASICs) to AirPoint. The contract is equivalent to about 27.9% of its 2025 revenue of approximately 10.6435 billion won.

The ASICs to be supplied are designed for electronic toll collection (ETC) terminals used on toll roads. They support dedicated short-range communications (DSRC), the communication standard used by Korea's Hi-Pass system.

The chips use a system-on-chip (SoC) architecture that integrates communication and signal processing functions into a single chip, incorporating processors based on the Arm and RISC-V instruction set architectures (ISAs). They meet automotive semiconductor reliability standards.

Customer AirPoint supplies chipsets and software for Hi-Pass terminals to Korean automakers. The company has purchased the same product from Zaram Technology for 10 years. The chips began being installed in vehicles manufactured for the Korean domestic market in 2024.

The contract runs through Dec. 1, 2027, although the expiration date may be adjusted through mutual agreement. All chips will be manufactured through outsourced production.

"The volume ordered today for the second half of next year exceeds our total annual supply volume for this year," Zaram Technology said.

Zaram Technology has also completed commercial validation of an ASIC for next-generation optical communications using 10-gigabit-capable symmetric passive optical network (XGS-PON) technology, jointly developed with a major European telecommunications equipment manufacturer. The company is also developing an on-device artificial intelligence (AI) chip that adds an AI accelerator to the same platform design. On-device AI refers to technology that processes AI computations directly within a device.