Ibiden 計劃投資 1.28 trillion won 擴充 CPU 封裝基板產能

(Photo: Ibiden)

Japanese semiconductor package substrate maker Ibiden plans to invest 1.28 trillion won to expand production capacity for high-performance semiconductor package substrates used in artificial intelligence (AI) servers. The investment is aimed at meeting growing demand for central processing unit (CPU) package substrates.

Ibiden's board of directors decided on Oct. 29 to expand production capacity for high-performance integrated circuit (IC) package substrates for CPUs at Building No. 6 of its Gama plant in Gifu Prefecture, Japan. The company also plans to invest in overseas production facilities. The new equipment will begin operations in phases from fiscal 2029. Ibiden did not disclose the scale of the planned capacity increase.

Ibiden expects demand for CPU substrates to increase as AI inference workloads grow and agentic AI becomes more widespread.

Ibiden also announced its first-half fiscal 2026 results for the April-September period on Oct. 29. Revenue totaled 262.546 billion yen, while operating profit reached 60.116 billion yen, up 34.3% and 84.6%, respectively, from a year earlier.

The electronics business, which produces semiconductor package substrates, drove the earnings improvement. Revenue in the segment rose 52% year-on-year to 172.54 billion yen, while operating profit surged 96.7% to 50.028 billion yen. The gains reflected stronger-than-expected orders for high-value-added products used in AI servers.

Ibiden also raised its full-year fiscal 2026 earnings forecast. The company increased its revenue outlook by 2.7% to 565 billion yen from 550 billion yen and lifted its operating profit forecast by 4.7% to 133 billion yen from 127 billion yen. Ibiden expects continued solid demand for products used in AI and general-purpose servers, along with growing demand for switch IC products.