Samsung Electro-Mechanics 簽署約 879.3 billion won 的 AI 伺服器 MLCC 供應合約

Multilayer ceramic capacitors (MLCCs).

Samsung Electro-Mechanics disclosed on Oct. 30 that it had signed a contract worth approximately 879.3 billion won to supply multilayer ceramic capacitors (MLCCs) for artificial intelligence (AI) servers to a major global company. It is the second-largest of the company’s MLCC long-term agreements (LTAs). The one-year contract runs from Dec. 21, 2026, to Dec. 21, 2027.

Including the latest agreement, Samsung Electro-Mechanics has disclosed eight LTAs this year. Since May, the company has signed multiple long-term supply contracts covering silicon capacitors (Si-Caps), MLCCs, inductors and flip-chip ball grid array (FC-BGA) substrates. Their cumulative value amounts to approximately 5.18 trillion won.

During its third-quarter earnings conference call, Samsung Electro-Mechanics said it had signed or was negotiating LTAs with about 50 customers. The company expects LTAs to account for more than half of its MLCC revenue next year.

Growing investment in AI servers is increasing demand for compact, ultra-high-capacitance MLCCs as servers require greater capacitance to ensure stable power delivery. Samsung Electro-Mechanics forecasts that demand next year for its 1005-size, 47-microfarad (μF) products supplied to new platforms from major technology companies will be approximately eight times this year’s level.

The company is also expanding production capacity to meet demand. It plans to invest approximately 15 trillion won in its Busan facility by 2040 to establish a high-value-added MLCC mother production line and expand capacity for high-performance package substrates. Mass production of advanced, high-value-added MLCCs is also scheduled to begin next year at a new factory under construction in the Philippines.

According to Goldman Sachs, the AI server MLCC market is expected to grow from $1.4 billion last year to $5.8 billion in 2030, representing a compound annual growth rate of approximately 34%. As graphics processing units (GPUs) and application-specific integrated circuits (ASICs) become more powerful and consume more electricity, required MLCC capacitance is projected to roughly double each year.