Hanmi Semiconductor 第三季業績按年增長，按季下跌約30%
Hanmi Semiconductor Q3 Profit Rises Year on Year but Falls 30% Sequentially
Hanmi Semiconductor 第三季營收按年增長8.9%至181 billion won，營業利潤增長33.9%至90.8 billion won，但兩者按季分別下跌27.9%及30.3%。受用於HBM生產的熱壓鍵合機（TC bonder）需求支持，營業利潤率升至50.2%，按年提高9.4個百分點。公司預期第四季業績改善，原因是部分原定第三季交付的設備延至第四季交付。
Hanmi Semiconductor. (Photo: Hanmi Semiconductor)
Hanmi Semiconductor reported year-on-year growth in third-quarter earnings, but its performance declined by about 30% from the previous quarter.
Hanmi Semiconductor said on Oct. 30 that third-quarter revenue reached 181 billion won and operating profit totaled 90.8 billion won, up 8.9% and 33.9%, respectively, from a year earlier. Increased demand for equipment such as thermocompression (TC) bonders used in high-bandwidth memory (HBM) production supported earnings growth.
The operating margin reached 50.2%, up 9.4 percentage points from 40.8% a year earlier. Hanmi Semiconductor said its high-value-added business structure, centered on AI semiconductor packaging equipment, drove growth.
However, both revenue and operating profit declined from the previous quarter, falling 27.9% and 30.3%, respectively.
Hanmi Semiconductor expects fourth-quarter results to improve from the third quarter as deliveries of some equipment originally scheduled for the third quarter were deferred to the fourth. The company also expects to set new annual records for both revenue and operating profit for a third consecutive year, following 2024 and 2025.
The company also expressed a positive medium- to long-term outlook, citing continued production capacity expansion by global semiconductor companies, particularly in the United States. Hanmi Semiconductor established a U.S. subsidiary, Hanmi USA, in California in October to accelerate its expansion into the American market.
Tesla CEO Elon Musk is building a Terafab in Texas, with operations scheduled to begin in 2028. The investment totals $119 billion, making it the largest single semiconductor manufacturing facility. Hanmi Semiconductor is reportedly part of the Terafab supply chain.
Micron, a major customer, is also building a new DRAM and HBM plant in Boise, Idaho, with operations scheduled to begin in 2027. Its megafab in Clay, New York, is expected to begin operations in 2030. SK hynix broke ground on an HBM packaging plant in Indiana in August, targeting operations in the second half of 2028. SK hynix is Hanmi Semiconductor’s largest domestic customer.
Hanmi Semiconductor also plans to expand shareholder returns. “We expect another record-high dividend this year,” the company said. It paid a year-end dividend of 800 won per share in 2025.
來源：The Elec · thelec.net