Taesung 向日本 Company F 供應設備，進軍玻璃基板設備市場

Taesung's new factory in Cheonan, completed last month. (Photo: THE ELEC)

Taesung has entered Japan's glass substrate equipment market. The company also indicated that it may supply additional glass substrate equipment to domestic and overseas customers before the end of the year.

Taesung said Oct. 28 it supplied wet-process equipment for glass substrate manufacturing to Japanese substrate manufacturer Company F. The equipment is used for surface treatment and fine-pattern formation during glass substrate production.

Company F is an existing Taesung customer. It has expertise in high-layer-count printed circuit boards (PCBs) and high-density semiconductor package substrates. The company is developing multilayer glass substrates.

Taesung did not disclose the customer's full name, contract value or number of equipment units supplied, citing a nondisclosure agreement (NDA).

This marks Taesung's first delivery of glass substrate equipment to Japan. The company said securing a supply track record with a major global customer before the market takes off is significant.

Glass substrates are considered a next-generation semiconductor packaging material that could overcome the limitations of conventional organic substrates. They are less susceptible to thermal deformation than organic substrates. Their flat surfaces also facilitate the formation of fine circuits. Glass substrates are expected to be used primarily in advanced semiconductor packaging, including artificial intelligence (AI) chips.

Taesung is expanding its glass substrate equipment business. Last year, it supplied through-glass via (TGV) cleaning equipment and etching equipment for glass substrates to major domestic and overseas customers.

"We are continuing discussions with major domestic and overseas customers on supplying glass substrate equipment," a Taesung official said. "We expect additional orders for glass substrate equipment to materialize before the end of this year."