GlobalFoundries 公佈 2026 年第三季初步財務業績

GLOBALFOUNDRIES Inc. (GF) (Nasdaq: GFS) today announced preliminary financial results for the third quarter ended September 30, 2026.

Key Third Quarter Financial Highlights

• Revenue of $1.899 billion
• Gross margin of 30.1% and Non-IFRS gross margin of 31.4%
• Operating margin of 12.1% and Non-IFRS operating margin of 17.9%
• Net income (loss) of $(270) million and Non-IFRS net income of $298 million
• Diluted earnings (loss) per share ("EPS") of $(0.49) and Non-IFRS EPS of $0.53
• Non-IFRS adjusted EBITDA of $647 million
• Ending cash, cash equivalents and marketable securities of $3.2 billion
• Net cash provided by operating activities of $341 million and Non-IFRS adjusted free cash flow of $136 million

Tim Breen, CEO of GlobalFoundries"We delivered strong results in the third quarter, with record non-IFRS gross margin reflecting a richer mix of business across high-value, high-growth AI applications. We saw particularly strong momentum across our key growth markets, led by record year-over-year revenue growth in communications infrastructure and data center, as well as strong growth in Automotive and Home and Industrial IoT. Together with the significant customer and government partnerships announced during the quarter, these results demonstrate the continued strategic diversification of GF's business and the strength of our differentiated technologies."

Recent Business Highlights

• In October 2026, GF was selected as the technology provider and operator for two new semiconductor fabs at its Malta, New York site under a landmark U.S.-Japan initiative that will provide up to $21 billion in funding. GF will contribute its differentiated technologies, manufacturing expertise and operational capabilities, for which it will be compensated through management and technology fees over the life of the project. An initial investment of approximately $10 billion will accelerate construction of a new 300 mm semiconductor fab, which is already underway, with capacity expected to come online in 2029. Together, the two fabs will add significant new U.S. manufacturing capacity and reinforce GF's ability to support customers worldwide.
• In October 2026, GF and the U.S. government ("USG") agreed to amend GF's existing CHIPS and Science Act award, reallocating $955 million of incentives to support GF's investments in advanced semiconductor manufacturing at its facilities in Malta, New York and Burlington, Vermont. The funding will help accelerate investments in silicon photonics, silicon germanium, and advanced packaging, including the first U.S.-based source of silicon interposers.
• In October 2026, GF entered into a multi-year, $2 billion manufacturing agreement with TSMC to establish a U.S.-based supply of silicon interposers for TSMC's CoWoS advanced packaging ecosystem. Under the agreement, GF will add manufacturing capacity at its Malta, New York facility, with volume production expected to begin ramping in the first half of 2028. The collaboration expands GF's advanced packaging capabilities and establishes a U.S.-based source of silicon interposers to support growing demand for AI and high-performance computing systems.
• In September 2026, GF issued 9.9 million ordinary shares to the USG, resulting in a $441 million non-cash charge recorded in non-operating expense, which was the primary driver of the IFRS net loss in the quarter.
• In September 2026, GF expanded its multi-year agreement with Marvell to increase manufacturing capacity for GF's high-performance silicon germanium (SiGe) technology at its Burlington, Vermont facility. The expanded capacity will support Marvell's growing requirements for next-generation pluggable optical transceivers, Near-Packaged Optics (NPO) and Co-Packaged Optics (CPO), strengthening GF's position in high-speed optical connectivity for AI and cloud data center infrastructure.
• In September 2026, GF entered into a long-term manufacturing agreement with Monolithic Power Systems (MPS) to deploy MPS's proprietary process technology at GF's 300 mm manufacturing facility in Singapore, with volume production planned for early 2027. The partnership expands manufacturing capacity for high-performance power management solutions, including next-generation products for automotive architectures, industrial robotics and automation, and smart power stages for AI and cloud infrastructure.

Dividend Payment
On October 27, 2026, the Board of Directors approved a dividend of $0.12 per share payable on January 14, 2027 to shareholders of record as of December 22, 2026.