DEEPX 與 AMD 討論 AI 晶片技術合作

From left: DEEPX CEO Kim Nok-won and Keith Strier, AMD's senior vice president of global AI markets. (Photo: DEEPX)

DEEPX, a fabless semiconductor company specializing in edge artificial intelligence (AI) chips, said Nov. 3 it discussed potential technology cooperation with AMD.

Keith Strier, AMD's senior vice president of global AI markets, and Jang Jung-hee, head of AMD Korea, visited DEEPX's headquarters in Pangyo that day. They met with DEEPX CEO Kim Nok-won to discuss potential collaboration in physical AI and heterogeneous computing.

DEEPX proposed two areas of cooperation. The first involves integrating its low-power neural processing unit (NPU) with AMD's Kria system-on-module (SOM) platform, enabling a single module to handle real-time robotic control and AI inference. The second proposal involves linking AMD's ROCm software platform for graphics processing units (GPUs) with DEEPX's software development kit (SDK). The goal is to create a computing environment that distributes workloads among central processing units (CPUs), GPUs and NPUs according to their respective strengths.

Discussions between the two companies began at the AMD-Korean AI Semiconductor Companies Roundtable hosted by the Ministry of Science and ICT on Oct. 7. AMD CEO Lisa Su met with Kim at the event, followed by a visit to DEEPX by AMD Korea representatives on Oct. 21.