Gaonchips 將採用 Samsung 8nm 製程開發新一代無人機 AI 晶片
Gaonchips to Develop AI Chip for Next-Generation Drones Using Samsung 8nm Process
Gaonchips 將參與 KAI 新一代無人系統 AI 半導體項目,採用 Samsung Electronics 8nm 製程實作本土研發的 NPU 及雷達訊號處理技術。Gaonchips 負責整個晶片的實體設計及最終設計驗證,Supergate 主導 AI 晶片架構設計和軟件開發。項目旨在為新一代消耗型無人飛行器開發 SoC,讓無人機可在通訊受幹擾或受限時透過裝置端處理執行 AI 任務。

Gaonchips will participate in KAI’s AI semiconductor development project for next-generation unmanned systems. (Photo: Gaonchips)
Gaonchips said on Oct. 19 it will participate in the development of an artificial intelligence (AI) semiconductor for next-generation unmanned systems operated by Korea Aerospace Industries (KAI).
Gaonchips will serve as a joint research and development partner in an aerial unmanned platform project overseen by KAI under the K-On-Device AI Semiconductor Technology Development Project, supported by the Ministry of Trade, Industry and Resources (MOTIR). Supergate is the lead developer.
The project aims to develop an AI system-on-chip (SoC) that will serve as the brain of next-generation expendable unmanned aerial vehicles. The SoC integrates multiple semiconductor circuits with different functions onto a single chip. It will enable drones to run AI and carry out missions independently through on-device processing, even in operational environments where communications are disrupted or limited.
Gaonchips will implement a domestically developed neural processing unit (NPU) and radar signal processing technology using Samsung Electronics’ 8-nanometer (nm) foundry process. The company will handle physical design and final design verification of the entire chip. Physical design involves translating logical circuits into actual patterns on a semiconductor wafer.
KAI will be responsible for system integration and verification of the unmanned platform, incorporating operational requirements and conditions from defense applications. Supergate will lead the AI chip architecture design and software development.
Gaonchips has accumulated experience in developing and mass-producing 5nm on-device AI semiconductors. It has also worked on next-generation 2nm AI chips and an AI accelerator design project for a Japanese customer using a 2nm gate-all-around (GAA) process and 2.5D packaging. The company is currently involved in other advanced-process projects, including an automotive AI semiconductor development project under the K-On-Device AI Semiconductor Technology Development Project.
“We will work closely with KAI and other participating organizations to validate domestically developed AI semiconductors on actual defense platforms and ensure they meet the required performance and reliability standards,” said Woo Jung-ho, executive vice president of Gaonchips. “We will also strengthen our capabilities in AI semiconductor design and commercialization tailored to various systems and application environments.”
來源:The Elec · thelec.net