BOS Semiconductors 聯同 LG Electronics、Hana Micron 開發汽車 chiplet 半導體

BOS Semiconductors is collaborating with LG Electronics and Hana Micron to develop domestically produced chiplet-based automotive semiconductors. (Source: BOS Semiconductors)

BOS Semiconductors said on Oct. 21 it will collaborate with LG Electronics and Hana Micron to develop chiplet-based automotive semiconductors.

The three companies will establish a cooperative framework covering the entire development cycle, from next-generation automotive chip design and integration to packaging, testing, validation and commercialization.

The initiative is part of the Manufacturing AI Transformation Alliance (M.AX Alliance), led by South Korea's Ministry of Trade, Industry and Resources (MOTIR).

BOS Semiconductors will develop and supply neural processing unit (NPU) chiplets for autonomous driving and in-vehicle AI computing.

The company will also support interoperability testing to ensure seamless connections between chiplets, as well as optimization and commercialization.

LG Electronics will provide a base chiplet responsible for key vehicle control functions.

Hana Micron will contribute its semiconductor packaging and testing capabilities to develop multi-chiplet packaging solutions that integrate several chiplets into a single package. It will also handle performance validation and technical support.

Chiplet technology involves manufacturing chips with different functions separately and connecting them through high-speed interconnects so they operate as a single component.

The approach allows semiconductor functions and performance to be combined flexibly, enabling manufacturers to meet different vehicle requirements using a common base platform. Developed chiplets can also be reused in other products.

BOS Semiconductors has selected chiplet technology as the architecture for its next-generation automotive AI semiconductors and is developing related technologies.

The company is optimizing its Eagle-A system-on-chip (SoC), which handles system control and processing, and its Eagle-N high-performance AI accelerator. It is also developing a chiplet-based computing platform.

BOS Semiconductors participates in the Universal Chiplet Interconnect Express (UCIe) ecosystem, which promotes an open-standard, high-speed communication specification for interconnecting different semiconductor chiplets.

The company is also participating in the Open Chiplet Atlas (OCA) ecosystem to develop chiplet interoperability technologies.