Shindo Eng Lab 提出將 HBM 堆疊於 GPU 下方的 3D 晶片封裝架構

Shindo Eng Lab’s glass-ceramic interposer-based 3D GPU-HBM stacking architecture unveiled at SEMICON West 2026 on Oct. 15 local time. (Photo: THE ELEC)

Shindo Eng Lab, a display bonding equipment maker, unveiled a chip packaging architecture that vertically stacks a graphics processing unit (GPU) and high-bandwidth memory (HBM) with a glass-ceramic interposer between them at SEMICON West 2026 in San Francisco on Oct. 15 local time.

The proposed structure places the GPU above and HBM below a glass-ceramic interposer approximately 200 micrometers (μm) thick. The two chips are connected through vertical conductive vias in the interposer. Liquid cooling modules are attached above the GPU and below the HBM to dissipate heat in opposite directions. Power is delivered from a printed circuit board (PCB) at the bottom through metal pillars to the interposer, which distributes it to both chips.

Current AI semiconductor packages use a 2.5D architecture that places GPUs and HBM side by side on a silicon interposer. Vertical stacking shortens the distance between chips but creates challenges, including concentrated heat and warpage caused by thermal expansion and contraction. Shindo claims its glass-ceramic interposer, which allows thermal expansion characteristics to be adjusted, combined with cooling on both sides, can mitigate these problems.

The technology used to form vertical conductive vias in the interposer is Through Glass-Ceramic Via (TGCV), which the company unveiled in September. The process uses photolithography to form hole patterns simultaneously in a glass-ceramic substrate before filling them with copper. Shindo initially introduced TGCV as a potential replacement for organic cores in flip-chip ball grid array (FC-BGA) substrates.

Shindo has primarily supplied lamination and vacuum bonding equipment used to attach display panels to cover windows. The company has no previous experience in the semiconductor substrate business.

It has filed a patent application for the proposed architecture and is holding technical discussions with approximately 10 companies. Samples have been provided to some of them. Shindo has not disclosed whether it intends to manufacture and sell interposers directly or supply equipment.

“Our ultimate goal is to implement a 3D architecture that vertically integrates GPUs and HBM using TGCV as the underlying technology,” a Shindo official said. “We plan to present the structure to outsourced semiconductor assembly and test (OSAT) companies and discuss potential applications.”