Taesung於台灣展示FC-BGA及玻璃基板設備

Taesung's booth at TPCA Show 2026 in Taiwan. (Photo: Taesung)

Taesung said on Oct. 21 that it is participating in TPCA Show 2026, which opened in Taipei, Taiwan, on Oct. 20. The company introduced key process equipment technologies for manufacturing flip-chip ball grid array (FC-BGA) and glass substrates.

Taesung showcased copper plating equipment for via filling and surface treatment technologies. The equipment is used to manufacture larger, higher-layer-count FC-BGA substrates as the markets for artificial intelligence (AI) servers and high-performance semiconductors expand. For glass substrates, the company introduced through-glass via (TGV) processing equipment and vertical developing, etching and plating systems.

The company recently signed an agreement to supply FC-BGA equipment to a major global semiconductor package substrate manufacturer. It also received a letter of intent (LOI) from a major South Korean substrate manufacturer to purchase copper plating equipment for SOCAMM module production. Taesung is in the final stages of discussions with domestic and overseas customers on mass-production supply of glass substrate equipment.

To meet growing demand, Taesung has established a mass-production system at its new Cheonan factory, which has more than six times the production capacity of its existing Ansan facility.

TPCA Show is an international printed circuit board (PCB) exhibition organized by the Taiwan Printed Circuit Association (TPCA). This year's event attracted approximately 670 companies worldwide, occupying 1,830 booths.